FPC制程能力 |
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| Items | 2010 | 2013 | ||
| 线宽/线距 | 3mil/3mil | 1.6mil/1.6mil | ||
| 线宽/线距公差 | ±0.02mm | ±0.01mm | ||
| 焊盘与线路的距离 | 0.1mm | 0.075mm | ||
| 线路与外形边的距离 | 0.15mm | 0.15mm | ||
| 最小焊盘尺寸 | 0.3x0.3mm | 0.3x0.3mm | ||
| 导通盘尺寸 | 0.45mm | 0.25mm | ||
| 最小PTH孔孔径 | 0.2mm | 0.1mm | ||
| 丝印对位公差 | ±0.2mm | ±0.075mm | ||
| 外形尺寸公差 | ±0.05mm | ±0.05mm | ||
| 孔径/孔位公差 | ±0.05mm | ±0.025mm | ||
| 镀镍厚度 | 1μm-5μm | 1μm-5μm | ||
| 镀金厚度 | 0.05μm-0.2μm | 0.05μm-0.2μm | ||
| 最多叠层数 | 8层 | 8层 | ||
项目 |
量产能力 |
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Chip器件 |
可加工最小尺寸电阻、电容电感 |
0201 |
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| SMT加工直通率 | 99.95% |
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连接器 |
?可加工最小Pitch 连接器 |
0.4mm |
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| SMT加工直通率 | 99.80% |
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BGA |
可加工最小Pitch BGA器件 | 0.4mm |
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| SMT加工直通率 | 99.80% |
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QFN |
可加工最小Pitch QFN器件 | 0.4mm |
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| SMT加工直通率 | 99.80% |
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LED |
LED灯贴装角度精度 | ±1° |
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| SMT加工直通率 | 99.90% |
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